Typically, one board level heat sink is used to increase the surface area available for heat transfer from an individual low- to medium-power semiconductor device, thus reducing the temperature of both its external case and its internal junction. The add-on heat sink allows the semiconductor device to perform at or near its highest level, with maximum reliability. Board level heat sinks are made for nearly all heat-dissipating semiconductor devices, including (but are not limited to) microprocessors, diodes, rectifiers, and transistors.

Our extensive selection of board level heat sinks will support virtually any and all natural convection and forced-air convection applications. These heat sinks are used in most medium-power electronic circuits. These include circuits designed for the following industries and applications: renewable energy, automotive, telecommunications, broadcast, military, RF and wireless, medical equipment, and factory automation.

When choosing a board level heat sink, always consider these important factors:

  • The specific thru-hole or surface-mount semiconductor package type in need of being cooled (TO-220, D2-Pak, SOT-223, BGA, etc.)
  • The specified Thermal Resistance (in °C/W)
  • The dimensions of the heat sink
  • The method by which the heat sink is “mounted” to either the PC board or the semiconductor device package itself: clip system, conventional (screw-down), adhesive, or PCB (thru-hole or surface mount)