1200 V / 16 mΩ fastPACK E2 SiC Module

Features:

  • Compact and low inductive design
  • High frequency SiC MOSFET
  • Integrated NTC
  • Kelvin Emitter for improved switching performance
  • Open Emitter configuration
  • Temperature sensor
  • High Blocking Voltage with low drain source on state resistance
  • High speed SiC-MOSFET technology
  • Resistant to Latch-up
  • Convex shaped substrate for superior thermal contact
  • Compact design
  • CTI600 Housing material
  • Thermo-mechanical push-and-pull force relief
  • Reliable cold welding connection to PCB
  • No PCB hole damage to enable reuse

Applications:

  • Charging Stations
  • Power Supply
  • Welding and Cutting
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