Hosted by Power Systems Design, featuring Cree, Power Integrations and Analog Devices
Now wide bandgap materials are established in the marketplace and being deployed in many applications, manufacturers are looking for ways to differentiate their products from the competition. Packaging, integration and higher voltage capabilities are just some of the methods being implemented to stand out from the crowd.
PSD’s Power Panel consists of a range of companies who will detail their own unique products and the benefits that they will bring to the next generation of power designs.
Join PSD Power Panel to learn how these companies are working to create new ranges of devices which will be more efficient, flexible, compact and easier to design into the next generation of products.
- How driving GaN/SiC devices can be a challenge, and how to overcome it
- An overview of applications powered by silicon carbide and the technology’s capabilities
- How advancements in SiC technology helped create the lowest on-resistance SiC FETs
- How GaN can be amazingly robust to AC line swells, surges and fast transients