650 V SiC Power MOSFETs in TO-Leadless (TOLL) Packages for High-Current, High-Power-Density Applications
TOLL MOSFETs with a compact footprint: enabling high efficiency and high power density in the most demanding server and data center applications
The surface-mount TOLL is an innovative package that the industry is adopting – typically for high-current, high-power–density applications. Wolfspeed’s industrial-application–qualified 650 V SiC MOSFETs in the TOLL package are significantly smaller than other package options. Compared with the standard TO-263-7L’s footprint of 151.5 mm2 and height of 4.30 mm, the TOLL device has a footprint of 113 mm2 and height of 2.2 mm. That is a nearly 25% reduction in footprint and an even more remarkable 50% reduction in height.
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