Evaluate GaNPX® Bottom-Cooled E-modes in High-Power Applications

This horizontal Insulated Metal Substrate (IMS3) evaluation platform can be used to evaluate the electrical and thermal performance benefits of GaNPX® bottom-side cooled E-modes in high power applications. The optimized thermal and electrical designs provide an excellent reference for implementing a low cost, high performance design.

Compatibility

  • GS-EVB-HBDB-IMS – 650 V Universal High-Power Half Bridge Driver Motherboard for IMS2 and IMS3
  • GSP665HPMB-EVBIMS2 – 650 V Universal High-Power Dual Half Bridge / Full Bridge Driver Motherboard for IMS2 and IMS3

Features and Benefits

  • Improved heat transfer
  • Increased power density
  • Reduced system cost
  • High thermal conductivity (7.0 W/mK)
  • IMS3 half bridge power boards available in 2 power levels: 3 kW and 6 kW

Applications

  • Automotive: 3.3kW-22kW on board charger, DC/DC, 3-phase inverter, high power wireless charger
  • Industrial: 3-7kW Photovoltaic Inverter and Energy Storage System (ESS), Motor Drive / VFD
  • Server/Datacenter: 3kW Server ACDC power supply
  • Consumer: Residential Energy Storage System (ESS)
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