New High-Power IMS3 Evaluation Platform from GaN Systems
Evaluate GaNPX® Bottom-Cooled E-modes in High-Power Applications
This horizontal Insulated Metal Substrate (IMS3) evaluation platform can be used to evaluate the electrical and thermal performance benefits of GaNPX® bottom-side cooled E-modes in high power applications. The optimized thermal and electrical designs provide an excellent reference for implementing a low cost, high performance design.
GS-EVB-HBDB-IMS – 650 V Universal High-Power Half Bridge Driver Motherboard for IMS2 and IMS3
GSP665HPMB-EVBIMS2 – 650 V Universal High-Power Dual Half Bridge / Full Bridge Driver Motherboard for IMS2 and IMS3
Features and Benefits
Improved heat transfer
Increased power density
Reduced system cost
High thermal conductivity (7.0 W/mK)
IMS3 half bridge power boards available in 2 power levels: 3 kW and 6 kW
Automotive: 3.3kW-22kW on board charger, DC/DC, 3-phase inverter, high power wireless charger
Industrial: 3-7kW Photovoltaic Inverter and Energy Storage System (ESS), Motor Drive / VFD
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