White Paper: New SiC module boosting the efficiency of power applications

2021-09-05T16:56:13-05:00September 5th, 2021|Categories: Featured, Hitachi ABB, White Paper|

LinPak is Hitachi ABB Power Grids’ semiconductor newest standard in high-power isolated modules The module was developed over the last ten years, with requirements coming from traction OEMs. It delivers in terms of having a half-bridge topology, the lowest stray inductance in its class and the highest power density. With the separation of the DC

Hitachi ABB RoadPak SiC e-mobility module

2021-07-28T13:18:47-05:00July 28th, 2021|Categories: Featured, Hitachi ABB, Silicon Carbide-Silicon Hybrid Modules|

Hitachi ABB’s newest innovative solution for all e-mobility applications It enables the design of converters with lowest overall stray inductance, thanks to the latest generation of SiC MOSFET chipset and enhanced liquid cooling performance due to its pin-fin baseplate. In addition, the RoadPak allows very easy low inductive connections, thus the current rating of

Hitachi ABB: High-Density SiC Power Modules Meet Formula E Challenges

2021-06-28T13:35:37-05:00June 28th, 2021|Categories: Article, Featured, Hitachi ABB|

Formula E, an electric-powered race car championship that began in 2014 and is currently known as “ABB FIA Formula E Championship” after ABB sponsorship in 2018, requires fully optimized power semiconductor modules, such as the latest generation of power converters. This article, based on a presentation held at PCIM Europe Digital Days 2021 by Milad

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