You are here:Home-Wakefield-Vette

Board Level Heat Sinks

2018-10-10T15:16:24-05:00July 20th, 2018|Categories: Board Level Heat Sinks, Featured, Microsemi, Ohmite, Wakefield-Vette|

Typically, one board level heat sink is used to increase the surface area available for heat transfer from an individual low- to medium-power semiconductor device, thus reducing the temperature of both its external case and its internal junction. The add-on heat sink allows the semiconductor device to perform at or near its highest level,

Wakefield-Vette Standard Liquid Cold Plates

2018-07-29T13:46:51-05:00May 23rd, 2018|Categories: Featured, Liquid Cold Plate Heat Sinks, Wakefield-Vette|

Exposed Tube Wakefield-Vette’s exposed tube liquid cold plates from Richardson RFPD ensure minimum thermal resistance between the power device and the cold plate by placing the coolant tube in direct contact with the power device’s base. Direct contact reduces the number of thermal interfaces between device and fluid thus increasing performance for the application.

Go to Top