650 V SiC Power MOSFETs in
TO-Leadless (TOLL) Packages

TOLL MOSFETs with a compact footprint: enabling high efficiency and high power density in the most demanding server and data center applications

The surface-mount TOLL is an innovative package that the industry is adopting – typically for high-current, high-power–density applications. Wolfspeed’s industrial-application–qualified 650 V SiC MOSFETs in the TOLL package are significantly smaller than other package options. Compared with the standard TO-263-7L’s footprint of 151.5 mm2 and height of 4.30 mm, the TOLL device has a footprint of 113 mm2 and height of 2.2 mm. That is a nearly 25% reduction in footprint and an even more remarkable 50% reduction in height.

  • Low lead inductance enables lower switching losses
  • Larger back metal tab enables lower junction temperature
  • Ideal for higher switching frequency applications
  • 25% smaller footprint as compared to the standard
    TO-263-7L package

  • Minimum creepage = 3.15 mm (D-S)
  • Ease of automated assembly
  • Ideal for ~400VDC applications
Part Number Request Sample Blocking Voltage Rds(on)
at 25°C
Current Rating Gate
Charge
Total
Output
Capacitance
Total
Power
Dissipation
Maximum
Junction
Temperature
PC3M0045065L Request Now 650 V 45 mΩ 51 A 59 nC 101 pF 160 W 150 °C
PC3M0060065L Request Now 650 V 60 mΩ 38 A 46 nC 80 pF 126 W 150 °C
PC3M0120065L Request Now 650 V 120 mΩ 21 A 25 nC 43 pF 89 W 150 °C

Related Content

PRESENTATION

Wolfspeed TOLL presentation

VIDEO

Ask an Expert

Design support is available from Richardson RFPD engineers.

GET STARTED!